Lenovo ThinkSystem HS350X V3
Optimized capacity and throughput to power your data-driven initiatives
Datasheet
Updated
23 Jan 2024Form Number
DS0173PDF size
2 pages, 291 KBInnovative, Storage Dense Design
The Lenovo ThinkSystem HS350X V3 supports 24x 3.5” hard drives, along with two 2.5” NVMe drives, in a 2U form factor, ensuring you can meet your growing and changing data storage requirements.
The three-tray design of the ThinkSystem HS350X V3 allows you to access the hot-swap drives without powering off the server, helping you to avoid significant interruption to the operation of the system.
Workload Versatility
The demands and volume of data-intensive workloads continue to evolve and grow. The Lenovo ThinkSystem HS350X V3 provides the capacity, performance, and density in a versatile, economical solution that allows organizations to focus on their core initiatives, making it ideal solution for a broad range of workloads, including the following:
- Object and scale-out file workloads
- Big data analytics
- Multimedia streaming
- AI/data lakes
- File shares/object buckets
- Backup and recovery
Hybrid Cloud-Ready
Make your infrastructure more scalable, efficient, and cost effective for your workloads.
The Lenovo ThinkSystem HS350X V3 is a key component within the Lenovo ThinkSystem HS350X V3 Ready Node software-defined solution, delivering the right infrastructure and capabilities organizations require for a consistent hybrid-cloud experience.
Industry-leading Reliability
Lenovo delivers engineered, tested, and certified IT solutions that are high performance, scalable and cost-effective.
By combining industry-leading x86 server technology and reliability, partnering to deliver best-in class co-innovation and providing end-to-end peace of mind. Lenovo continues to lead the industry in best uptime among all x86 platforms.
Specifications
| Form Factor/Height | 2U |
| Processor | 1x 4th or 5th Gen Intel® Xeon® Scalable processor, up to 350W TDP |
| Drive Bays | Front: 24x 3.5” HDD drives (support via 24 port SATA/SAS RAID/HBA card) Rear: 2x 2.5” NVMe SSDs Internal: 2x NVMe M.2 boot drives, VROC support |
| Memory | 16x TruDDR5 RDIMMs, up to 1TB 1DPC @4800MHz; 2DPC@4400MHz |
| Networking | LOM via OCP & PCIe Adapters |
| Front I/O | Power Button with Power Status LED UID Button with UID LED Network Activity LED System Health LED, HDD warning LED 1x USB 3.2 Gen1 (5 Gbps) |
| Rear I/O | Riser 1: x8 FHHL+ x16 FHHL PCIe Gen4 Riser 2: x16 HHHL PCIe Gen4 1x OCP 3.0 PCIe Gen5 slot |
| Power | 2x 1300W/1600W CRPS PT Power Supply Unit (PSU) 2x 1300W CRPS TT Power Supply Unit (PSU) |
| Cooling | Redundant Hot Swap Fans (N+1) |
| Management | Vertical DC-SCM 1.0 1x Management Network Port 2x USB 3.2 Gen1 (5 Gbps) VGA Power Button with Power Status LED System Health LED UID Button with UID LED |
| Operating Systems | Ubuntu 22.04.3 GA, RHEL 9.2, Rocky Linux 8.8, 9.2 |
| Limited Warranty | Standard 3-year base warranty, extendable to 5 years |
About Lenovo
Lenovo (HKSE: 992) (ADR: LNVGY) is a US$62 billion revenue global technology powerhouse, ranked #171 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver smarter technology for all, Lenovo is expanding into new growth areas of infrastructure, mobile, solutions and services. This transformation is building a more inclusive, trustworthy, and sustainable digital society for everyone, everywhere.
For More Information
To learn more about the Lenovo ThinkSystem HS350X V3, contact your Lenovo representative or Business Partner or visit lenovo.com/thinksystem. For detailed specifications, consult the HS350X V3 Product Guide.
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Availability: Offers, prices, specifications and availability may change without notice. Lenovo is not responsible for photographic or typographic errors. Warranty: For a copy of applicable warranties, write to: Lenovo Warranty Information, 1009 Think Place, Morrisville, NC, 27560. Lenovo makes no representation or warranty regarding third-party products or services.
Trademarks: Lenovo, the Lenovo logo, ThinkSystem® are trademarks or registered trademarks of Lenovo. Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries. Linux® is the trademark of Linus Torvalds in the U.S. and other countries. Other company, product, or service names may be trademarks or service marks of others.
Document number DS0173, published January 23, 2024. For the latest version, go to lenovopress.lenovo.com/ds0173.
