Lenovo ThinkSystem SR860 V3 Server

The Lenovo ThinkSystem SR860 V3 is a 4-socket server that features a 4U rack design with support for high-performance GPUs. The server offers technology advances, including fourth-generation Intel Xeon Scalable processors, and scale-up capacity of up to 16TB of system memory, up to 18x PCIe slots, and up to 48x 2.5-inch drive bays.

Suggested uses: Mission critical workloads such as SAP HANA in-memory computing, transactional databases, deep learning, analytics, big data, and virtual machine density.

Figure 1. Lenovo ThinkSystem SR860 V3

The Lenovo ThinkSystem SR860 V3 provides the advanced capabilities of four of the new 4th Gen Intel Xeon Scalable processors plus support for four double-wide GPUs. This combination gives you significant processing power in one server.

The SR860 V3 has space for 48x 2.5-inch drive bays, 24 of which can be configured as AnyBay drives - supporting SAS, SATA or NVMe drives. NVMe drives are high-speed, low-latency storage, ideal for storage tiering.

The flexible ThinkSystem SR860 V3 server supports fourth-generation Intel Xeon Scalable Gold or Platinum processors and can scale from two to four processors. Built for standard workloads like general business applications and server consolidation, it can also accommodate high-growth areas such as databases and virtualization. The ThinkSystem SR860 V3’s agile design permits rapid upgrades for processors and memory, and its large, flexible storage capacity helps to keep pace with data growth.

With the capability to support up to 64 DIMMs, four sockets, up to 48 drives for internal storage, support for up to eight 75W single-wide GPUs or four high-performance 350W double-wide GPUs, and two dedicated OCP 3.0 slots for 1, 10, 25 or 100 GbE networking, the SR860 V3 provides unmatched features and capabilities in a 4U rack-mount design.

Scalability and performance

The SR860 V3 offers numerous features to boost performance, improve scalability and reduce costs: 

• Supports two or four 4th Gen Intel Xeon Processor Scalable processors, allowing you to start with two processors and then upgrade to four when you need it.
• Supports Gold and Platinum processors in the Intel Xeon Processor Scalable Family. Processors supported:
  • Up to 60 cores
  • Core speeds of up to 3.7 GHz
  • TDP ratings of up to 350W
• Up to four processors, 240 cores, and 480 threads maximize the concurrent execution of multithreaded applications.
• Support for embedded Intel accelerators:
  • Intel QuickAssist Technology (QAT)
  • Intel Dynamic Load Balancer (DLB)
  • Intel In-Memory Analytics Accelerator (IAA)
  • Intel Data Streaming Accelerator (DSA)
• Enhanced inter-processor communications with three UPI connections between adjacent processors ensures increased CPU I/O throughput.
• Support for up to 64 TruDDR5 memory DIMMs operating at up to 4800 MHz means you have the fastest available memory subsystem and memory capacity of up to 16 TB with 64x 256 GB 3DS RDIMMs.
• Supports configurations of 2 DIMMs per channel to operate at the 4400 MHz rated speed of the memory DIMMs.
• Supports the new Intel Optane Persistent Memory 300 Series in App Direct mode for advanced in-memory database applications; up to 32 PMem Modules can be installed in conjunction with regular system memory. PMem modules are up to 512 GB each, for a total of up to 16 TB of Persistent Memory (4 TB per processor).
• The use of solid-state drives (SSDs) instead of, or along with, traditional spinning drives (HDDs), can improve I/O performance. An SSD can support up to 100 times more I/O operations per second (IOPS) than a typical HDD.
• Up to 48x 2.5-inch drive bays -- supporting combinations of SAS or SATA HDDs, SAS or SATA SSDs, and NVMe PCIe Gen4 or Gen5 SSDs -- provide a flexible and scalable all-in-one platform to meet your increasing demands. Up to 24x NVMe drives are supported, maximizing drive I/O performance in terms of throughput, bandwidth, and latency.
• The server has two dedicated industry-standard OCP 3.0 small form factor (SFF) slots, with a PCIe 5.0 x16 interface, supporting a variety of Ethernet network adapters. Simple-swap mechanism with thumbscrews and pull-tab enables tool-less installation and removal of the adapter. Supports shared BMC network sideband connectivity to enable out-of-band systems management.
• Up to 18 PCIe slots in addition to the two OCP 3.0 Ethernet slots to maximize I/O capabilities.
• The server is Compute Express Link (CXL) v1.1 Ready. With CXL 1.1 for next-generation workloads, you can reduce compute latency in the data center and lower TCO. CXL is a protocol that runs across the standard PCIe physical layer and can support both standard PCIe devices as well as CXL devices on the same link.
• High-speed RAID controllers from Lenovo and Broadcom provide 12 Gb SAS connectivity to the drive backplanes. A variety of RAID adapters are available, with cache up to 8 GB and support for 32 drives on a single controller.
• Support for four high-performance double-wide GPUs, or eight single-wide GPUs, adding additional processing power to the server.
• Supports up to two externally accessible 7mm hot-swap drives with VROC RAID functionality, in addition to the 48 front drive bays. These 7mm drives are ideal for operating system boot functions.
• As an alternative to the 7mm drives, the server supports an M.2 adapter (non-RAID) for convenient operating system boot functions. Available M.2 adapters support VROC RAID for boot drive performance and reliability.
• Supports Intel VROC (Virtual RAID on CPU) which enables basic RAID functionality on the onboard NVMe ports of the server, with no additional adapter needed. This feature enables RAID on NVMe drives (including 7mm and M.2 drives) without the need for a separate RAID adapter.

Availability and serviceability

The SR860 V3 provides many features to simplify serviceability and increase system uptime:

• Designed to run 24 hours a day, 7 days a week
• The server offers Single Device Data Correction (SDDC, also known as Chipkill), Adaptive Double-Device Data Correction (ADDDC, also known as Redundant Bit Steering or RBS) and memory mirroring for redundancy in the event of a non-correctable memory failure.
• The server offers hot-swap drives, supporting RAID redundancy for data protection and greater system uptime.
• Support for VROC to enable RAID-1 support on M.2 or 7mm drives for enhanced data protection of boot drives
• The server has up to four hot-swap redundant power supplies and 12x N+1 redundant fans to provide availability for business-critical applications.
• The power-source-independent light path diagnostics uses LEDs to lead the technician to failed (or failing) components, which simplifies servicing, speeds up problem resolution, and helps improve system availability.
• Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (SAS/SATA HDDs and SSDs, NVMe SSDs, M.2 storage, flash storage adapters), fans, power supplies, RAID controllers, server ambient and subcomponent temperatures. Alerts can be surfaced through the XClarity Controller to managers such as Lenovo XClarity Administrator, VMware vCenter, and Microsoft System Center. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
• Solid-state drives (SSDs) offer more reliability than traditional mechanical HDDs for greater uptime.
• The built-in XClarity Controller continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures, to minimize downtime.
• Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
• Lenovo XClarity Provisioning Manager collects and saves service data to USB key drive or remote CIFS share folder, for troubleshooting and to reduce service time.
• Auto restart in the event of a momentary loss of AC power (based on the power policy setting in the XClarity Controller service processor)
• Offers a diagnostics port on the front of the server to allow you to attach an external diagnostics handset for enhanced systems management capabilities.
• Support for the XClarity Administrator Mobile app running on a supported smartphone or tablet and connected to the server through the front USB 2.0 port, enables additional local systems management functions.
• 3-year or 1-year customer-replaceable unit and onsite limited warranty, 9 x 5 next business day. Optional service upgrades are available.

The ThinkSystem SR860 V3 improves on the previous generation SR860 V2, as summarized in the following table.

The following table lists the standard specifications.

The SR860 V3 servers are shipped with the following items:

• Documentation flyer
• Rail kit (model dependent)
• Power cords (model and region dependent)

ThinkSystem SR860 V3 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).

Configure-to-order (CTO) models are used to create models with factory-integrated server customizations. For CTO models, two types of base CTO models are available for the SR860 V3 as listed in the columns in the following table:

• General purpose base CTO models are for general business (non-HPC) and is selectable by choosing General Purpose mode in DCSC.
• AI and HPC base models are intended for Artificial Intelligence (AI) and High Performance Computing (HPC) configurations and solutions are enabled using the AI & HPC Hardware - ThinkSystem Hardware mode in DCSC. These configurations, along with Lenovo EveryScale Solutions, can also be built using System x and Cluster Solutions Configurator (x-config). Tip: Some HPC and AI models are not listed in DCSC and can only be configured in x-config.

Preconfigured server models may also be available for the SR860 V3, however these are region-specific; that is, each region may define their own server models, and not all server models are available in every region.

The following table lists the base CTO models of the ThinkSystem SR860 V3 server.

Models of the SR860 V3 are defined based on whether the server will support GPUs or not. For GPU support (or any other full-length adapters), the server uses special low-profile winged heatsinks on the rear processors. Feature codes for these chassis bases are as listed in the following table.

The SR860 V3 supports Gold and Platinum level processors in the 4th Gen Intel Xeon Scalable Processor family. The server supports two or four processors.

The four processors are connected together using a mesh topology. A mesh topology allows all four processors to be connected together which improves the performance of processor-to-processor communications. The SR860 V3 implements a mesh topology using 3 UPI links.

Topics in this section:

• Heatsinks
• Processor options
• Processor features
• Two-processor configurations
• Thermal requirement by processor
• UEFI operating modes

Heatsinks

Heatsinks for the processors are auto-derived based on the Base feature code selected. As listed in the Models section, there are two base feature codes related to heatsinks, one for double-wide (DW) GPU support and one that does not support DW GPUs. The DW GPU base derives two standard heatsinks for the front processors and two low-profile winged heatsinks for the rear processors. The standard base derives four standard heatsinks.

Configuration notes:

• Processor options include a heatsink but do not include a system fan

• Intel Dynamic Load Balancer (Intel DLB)

  Improve the system performance related to handling network data on multi-core Intel Xeon Scalable processors. Intel Dynamic Load Balancer (Intel DLB) enables the efficient distribution of network processing across multiple CPU cores/threads and dynamically distributes network data across multiple CPU cores for processing as the system load varies. Intel DLB also restores the order of networking data packets processed simultaneously on CPU cores.

• Intel Data Streaming Accelerator (Intel DSA)

  Drive high performance for storage, networking, and data-intensive workloads by improving streaming data movement and transformation operations. Intel Data Streaming Accelerator (Intel DSA) is designed to offload the most common data movement tasks that cause overhead in data center-scale deployments. Intel DSA helps speed up data movement across the CPU, memory, and caches, as well as all attached memory, storage, and network devices.

• Intel In-Memory Analytics Accelerator (Intel IAA)

  Run database and analytics workloads faster, with potentially greater power efficiency. Intel In-Memory Analytics Accelerator (Intel IAA) increases query throughput and decreases the memory footprint for in-memory database and big data analytics workloads. Intel IAA is ideal for in-memory databases, open source databases and data stores like RocksDB, Redis, Cassandra, and MySQL.

• Intel Advanced Matrix Extensions (Intel AMX)

  Intel Advanced Matrix Extensions (Intel AMX) is a built-in accelerator in all Silver, Gold, and Platinum processors that significantly improves deep learning training and inference. With Intel AMX, you can fine-tune deep learning models or train small to medium models in just minutes. Intel AMX offers discrete accelerator performance without added hardware and complexity.

The processors also support a separate and encrypted memory space, known as the SGX Enclave, for use by Intel Software Guard Extensions (SGX). The size of the SGX Enclave supported varies by processor model. Intel SGX offers hardware-based memory encryption that isolates specific application code and data in memory. It allows user-level code to allocate private regions of memory (enclaves) which are designed to be protected from processes running at higher privilege levels.

The following table summarizes the key features of all supported 4th Gen processors in the SR860 V3.

Two-processor configurations

The SR860 V3 can be used with only two processors installed. Most core functions of the server (including the XClarity Controller) are connected to processors 1 and 2.

With only two processors, the server has the following capabilities:

• 32 memory DIMMs for an 8TB maximum
• Up to 16 PMem modules
• 10 slots are available - see I/O expansion for details
  • Riser 1: slots 3, 6, 8
  • Riser 2: slots 11, 14
  • Riser 3: slots 15, 18, 20
  • Two OCP slots
• Support for only 2x DW GPUs or 4x SW GPUs
• Up to 8x NVMe drives

Thermal requirement by processor

The following thermal requirements apply to the SR860 V3:

• Servers with DW GPUs and full-length adapters: Processors with TDP 270W or lower

The use of full-length PCIe adapter (for example double-wide GPUs) requires the use of the lower-height winged heatsink for the rear processors. These heatsinks limit the processors to 270W TDP or less.

The following table lists the feature codes that allow you to specify the mode you wish to preset in the factory for CTO orders.

The preset modes for the SR860 V3 are as follows:

• Maximum Performance Mode (feature BFYB): Achieves maximum performance but with higher power consumption and lower energy efficiency.
• Minimal Power Mode (feature BFYC): Minimize the absolute power consumption of the system.
• Efficiency Favoring Power Savings Mode (feature BFYD): Maximize the performance/watt efficiency with a bias towards power savings. This is the favored mode for SPECpower benchmark testing, for example.
• Efficiency Favoring Performance Mode (feature BFYE): Maximize the performance/watt efficiency with a bias towards performance. This is the favored mode for Energy Star certification, for example.

For details about these preset modes, and all other performance and power efficiency UEFI settings offered in the SR860 V3, see the paper "Tuning UEFI Settings for Performance and Energy Efficiency on Intel Xeon Scalable Processor-Based ThinkSystem Servers", available from https://lenovopress.lenovo.com/lp1477.

The SR860 V3 uses Lenovo TruDDR5 memory operating at up to 4800 MHz. The server supports up to 64 DIMMs with 4 processors. The processors have 8 memory channels and support 2 DIMMs per channel (DPC). The server supports up to 16TB of memory using 64x 256GB 3DS RDIMMs and four processors. DIMMs operate at 4800 MHz at 1 DPC and 4400 MHz at 2 DPC.

Lenovo TruDDR5 memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo TruDDR5 memory automatically assumes the system warranty, and Lenovo provides service and support worldwide.

The following table lists the 4800 MHz memory options that are currently supported by the SR860 V3.

9x4 RDIMMs (also known as EC4 RDIMMs) are a new lower-cost DDR5 memory option supported in ThinkSystem V3 servers. 9x4 DIMMs offer the same performance as standard RDIMMs (known as 10x4 or EC8 modules), however they support lower fault-tolerance characteristics. Standard RDIMMs and 3DS RDIMMs support two 40-bit subchannels (that is, a total of 80 bits), whereas 9x4 RDIMMs support two 36-bit subchannels (a total of 72 bits). The extra bits in the subchannels allow standard RDIMMs and 3DS RDIMMs to support Single Device Data Correction (SDDC), however 9x4 RDIMMs do not support SDDC. Note, however, that all DDR5 DIMMs, including 9x4 RDIMMs, support Bounded Fault correction, which enables the server to correct most common types of DRAM failures.

For more information on DDR5 memory, see the Lenovo Press paper, Introduction to DDR5 Memory, available from https://lenovopress.com/lp1618.

The following rules apply when selecting the memory configuration:

• The SR860 V3 only supports quantities of 1, 2, 4, 6, 8, 12, or 16 DIMMs per processor; other quantities not supported
• The server supports three types of DIMMs: 9x4 RDIMMs, RDIMMs, and 3DS RDIMMs; UDIMMs and LRDIMMs are not supported
• Mixing of DIMM types is not supported (9x4 DIMMs with 10x4 RDIMMs, 9x4 DIMMs with 3DS RDIMMs, 10x4 RDIMMs with 3DS RDIMMs)
• Mixing of DRAM technology (16Gb and 24Gb) is not supported. See the column in the above table.
• Mixing x4 and x8 DIMMs is not supported
• Mixing of DIMM rank counts is supported. Follow the required installation order installing the DIMMs with the higher rank counts first.
• Mixing of DIMM capacities is supported, however only two different capacities are supported across all channels of the processor. Follow the required installation order installing the larger DIMMs first.
• Memory mirroring is not supported with 9x4 DIMMs
• The mixing of 128GB 3DS RDIMMs and 256GB 3DS RDIMMs is supported, however all DIMM slots must be populated evenly: 8x 128GB DIMMs and 8x 256GB DIMMs per processor
• Mixing DIMMs with 16Gb and 24Gb DRAM is not supported; this means the 96GB DIMM (feature BZC2) cannot be mixed with any other DIMM
• The 96GB DIMM, feature BZC2, requires a Platinum processor

For best performance, consider the following:

See the Lenovo Press article "RAS Features of the Lenovo ThinkSystem Intel Servers" for more information about memory RAS features: https://lenovopress.lenovo.com/lp1711-ras-features-of-the-lenovo-thinksystem-intel-servers

If memory channel mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per processor), and both DIMMs in the pair must be identical in type and size. 50% of the installed capacity is available to the operating system. Memory rank sparing is not supported.

The SR860 V3 supports up to 48x 2.5-inch SAS/SATA drive bays, up to 24 of which can be AnyBay drive bays instead. All 48x drive bays are hot-swap and all front-accessible. The server also supports internal M.2 drives (one or two, installed in an adapter), or rear-accessible hot-swap 7mm SSDs (installed in a PCIe slot).

In this section:

• NVMe drive support
• Front drive bays
• Supported drive bay combinations
• M.2 drives
• 7mm drives
• SED encryption key management with SKLM

NVMe drive support

The SR860 V3 supports up to 24x NVMe drives with a PCIe 5.0 interface to maximize storage performance, each with a direct connection to the processors. All connections are made using onboard connectors; no NVMe retimer adapters are needed or supported. There is no oversubscription: each x4 drive has a full x4 (four PCIe Gen5 lanes) connection to the processor.

The locations of the backplanes is shown in the following figure.

Figure 6. Backplanes

Ordering information for the backplanes is listed in the following table.

Supported drive bay combinations

The following table shows the supported drive bay combinations - SAS/SATA or AnyBay drives. The table lists the backplanes required for each drive bay combination.

Some configurations require 4 processors be installed or are only supported when there are 2 processors. This is noted in the table.

The supported M.2 modules are listed in the following table. For field upgrades see the M.2 field upgrades section below.

Configuration notes:

• M.2 and 7mm are mutually exclusive: they are not supported together in the same configuration
• RAID support is implemented as follows:
  • ThinkSystem M.2 SATA/NVMe 2-Bay Enablement Kit (4Y37A09738): VROC (SATA or NVMe); No additional adapter is required nor supported
  • ThinkSystem M.2 SATA/x4 NVMe 2-Bay Adapter (4Y37A79663): VROC (SATA or NVMe); No additional adapter is required nor supported
  • ThinkSystem M.2 NVMe 2-Bay RAID Adapter (4Y37A09750): RAID implemented using an onboard Marvell 88NR2241 NVMe RAID Controller (NVMe only)
• If RAID is enabled using VROC, select these feature codes:
  • VROC SATA support: On Board SATA Software RAID Mode for M.2 (feature BS7Q)
  • VROC NVMe support:
    • Intel VROC (VMD NVMe RAID) Standard for M.2 (feature BS7M)
    • Intel VROC RAID1 Only for M.2 (feature BZ4X)

M.2 field upgrades

For field upgrades, the SR860 V3 also requires an additional M.2 cable kit.

Ordering information is listed in the following table.

The use of the 7mm rear drive bays has the following configuration rules:

• The location of the 7mm drives is based on the riser card selected.
• M.2 and 7mm are mutually exclusive: they are not supported together in the same configuration
• For ThinkSystem SR850 V3/SR860 V3 7mm SATA/NVMe 2-Bay Rear Enablement Option Kit (4XB7A88714):
  • The 7mm drive bays support either SATA drives or NVMe drives but not both at the same time.
  • RAID support is implemented using VROC SATA or VROC NVMe; No additional adapter is required nor supported.
  • If RAID is enabled using VROC, select these feature codes:
    • VROC SATA support: On Board SATA Software RAID Mode for 7mm (feature BS7U)
    • VROC NVMe support:
      • Intel VROC (VMD NVMe RAID) Standard for 7mm (feature BS7R)
      • Intel VROC RAID1 Only for 7mm (feature BZ4Y)
• For ThinkSystem SR850 V3/SR860 V3 7mm NVMe 2-Bay RAID Rear Enablement Option Kit (4XB7A88715):
  • The 7mm drive bays only support NVMe drives
  • RAID functionality is integrated into the M.2 adapter using a Marvell 88NR2241 NVMe RAID Controller
• For ThinkSystem 7mm SATA/NVMe 2-Bay Rear Hot-Swap RAID Enablement Kit (4Y37A90062)
  • The 7mm drive bays support either SATA or NVMe drives
  • RAID functionality is integrated into the 7mm adapter using a Broadcom SAS3808N RAID Controller

Field upgrades are enabled by replacing Riser 3 with a riser that enables support for the 7mm drives, as listed in the Riser ordering information section.

The SR860 V3 supports offers a variety of controller options for internal drives:

• For 2.5-inch drives:
  • Onboard NVMe ports (RAID support provided using Intel VROC NVMe RAID)
  • RAID adapters and HBAs for SAS/SATA drives
• For 7mm drive bays in the rear of the server (see the 7mm drives section)
  • SATA controller integrated into the 7mm drive bay enclosure
  • NVMe controller integrated into the 7mm drive bay enclosure
• For M.2 drives internal to the server (see M.2 drives section)
  • SATA controller integrated on the M.2 adapters
  • NVMe controller integrated on the M.2 adapters

The following table lists the controllers and adapters used for the internal 2.5-inch drive bays of the SR860 V3 server.

• E810 Ethernet and X350 RAID/HBAs: The use of both an Intel E810 network adapter and an X350 HBA/RAID adapter (9350, 5350 and 4350) is supported, however E810 firmware CVL4.3 or later is required. For details, see Support Tip HT513226.

VROC SATA RAID (RSTe) is available and supported with all SATA drives. It offers a 6 Gb/s connection to each drive and on the SR860 V3 implements RAID levels 0, 1, 5, and 10. RAID 1 is limited to 2 drives per array, and RAID 10 is limited to 4 drives per array. Hot-spare functionality is also supported.

VROC NVMe RAID offers RAID support for any NVMe drives directly connected to the ports on the server's system board or via adapters such as NVMe retimers or NVMe switch adapters. On the SR860 V3, RAID levels implemented are based on the VROC feature selected as indicated in the following table. RAID 1 is limited to 2 drives per array, and RAID 10 is limited to 4 drives per array. Hot-spare functionality is also supported.

The SR860 V3 supports the VROC NVMe RAID offerings listed in the following table.

Configuration notes:

• If a feature code is ordered in a CTO build, the VROC functionality is enabled in the factory. For field upgrades, order a part number and it will be fulfilled as a Feature on Demand (FoD) license which can then be activated via the XCC management processor user interface.

For specifications about the RAID adapters and HBAs supported by the SR860 V3, see the ThinkSystem RAID Adapter and HBA Comparison, available from:
https://lenovopress.com/lp1288-lenovo-thinksystem-raid-adapter-and-hba-reference#sr860-v3-support=SR860%2520V3

For details about these adapters, see the relevant product guide:

• SAS HBAs: https://lenovopress.com/servers/options/hba
• RAID adapters: https://lenovopress.com/servers/options/raid

The following tables list the drive options for internal storage of the server.

The server does not support any internal backup units, such as tape drives or RDX drives. 

The server does not support an internal optical drive.

An external USB optical drive is available, listed in the following table.

The SR860 V3 supports up to 20 PCIe slots: 18x regular PCIe slots – either Gen4 or Gen5 – plus two OCP 3.0 slots with Gen5 interfaces.

Topics in this section:

• Riser & slot support
• Riser ordering information
• Riser supported combinations

Figure 8. Slots in the SR860 V3

Riser & slot support

The SR860 V3 server supports Gen4-only or Gen5+Gen4 slot configurations to suit the needs of installed applications.

18x Gen4 + 2x OCP Gen5 slots

For applications that require as many slots as possible, the SR860 V3 supports a configuration with 18x Gen4 slots plus 2x OCP slots. The configuration supports 4x double-wide GPUs and optionally supports 7mm hot-swap drive bays installed in place of slot 20.

• OCP slots:
  • Slot 1: Gen5 x16 OCP 3.0 slot (CPU 1, Note: OCP 3.0 is support PCIe Gen4)
  • Slot 2: Gen5 x16 OCP 3.0 slot (CPU 2, Note: OCP 3.0 is support PCIe Gen4)
• Riser 1:
  • Slot 3: Gen4 x8 FHFL (CPU 1) (Not present if slot 4 is double-wide GPU)
  • Slot 4: Gen4 x16 FHFL (CPU 4) (Capable for double-wide GPU)
  • Slot 5: Gen4 x8 FHFL (CPU 4) (Not present if slot 6 is double-wide GPU)
  • Slot 6: Gen4 x16 FHFL (CPU 1) (Capable for double-wide GPU)
  • Slot 7: Gen4 x8 FHHL (CPU 4)
  • Slot 8: Gen4 x16 FHHL (CPU 1)
• Riser 2:
  • Slot 9: Gen4 x8 HHHL (CPU 4)
  • Slot 10: Gen4 x8 HHHL (CPU 4)
  • Slot 11: Gen4 x8 HHHL (CPU 1)
  • Slot 12: Gen4 x8 HHHL (CPU 3)
  • Slot 13: Gen4 x8 HHHL (CPU 3)
  • Slot 14: Gen4 x8 HHHL (CPU 2)
• Riser 3:
  • Slot 15: Gen4 x8 FHFL (CPU 2) (Not present if slot 16 is double-wide GPU)
  • Slot 16: Gen4 x16 FHFL (CPU 3) (Capable for double-wide GPU)
  • Slot 17: Gen4 x8 FHFL (CPU 3) (Not present if slot 18 is double-wide GPU)
  • Slot 18: Gen4 x16 FHFL (CPU 2) (Capable for double-wide GPU)
  • Slot 10: Gen4 x8 FHHL (CPU 3)
  • Slot 20: Gen4 x16 FHHL (CPU 2) (Not present if select 7mm)

The 18-slot configuration is shown in the following figure. Blue slots are Gen4 and green slots are Gen5. The red shading indicates the slots where double-wide GPUs are supported. The processor that each slot is connected to is also shown in the figure.

Figure 9. Slot configuration with 18x Gen4 slots

12x Gen5 + 4x Gen4 + 2x OCP Gen5 slots

For applications that require PCIe Gen5 slots, the SR860 V3 supports a configuration with 12x Gen5 slots, 4x Gen4 slots, plus 2x OCP slots. The configuration supports 4x double-wide GPUs and optionally supports 7mm hot-swap drive bays installed in place of slot 20.

• OCP slots:
  • Slot 1: Gen5 x16 OCP 3.0 slot (CPU 1, Note: OCP 3.0 is support PCIe Gen4)
  • Slot 2: Gen5 x16 OCP 3.0 slot (CPU 2, Note: OCP 3.0 is support PCIe Gen4)
• Riser 1:
  • Slot 3: Gen5 x8 FHFL (CPU 1) (Not present if slot 4 is double-wide GPU)
  • Slot 4: Gen5 x16 FHFL (CPU 4) (Capable for double-wide GPU)
  • Slot 5: Empty
  • Slot 6: Gen5 x16 FHFL (CPU 1) (Capable for double-wide GPU)
  • Slot 7: Gen5 x16 FHHL (CPU 4)
  • Slot 8: Gen4 x16 FHHL (CPU 1)
• Riser 2:
  • Slot 9: Gen5 x8 HHHL (CPU 4)
  • Slot 10: Gen5 x8 HHHL (CPU 4)
  • Slot 11: Gen4 x8 HHHL (CPU 1)
  • Slot 12: Gen4 x8 HHHL (CPU 3)
  • Slot 13: Gen5 x8 HHHL (CPU 3)
  • Slot 14: Gen5 x8 HHHL (CPU 2)
• Riser 3:
  • Slot 15: Gen5 x8 FHFL (CPU 2) (Not present if slot 16 is double-wide GPU)
  • Slot 16: Gen5 x16 FHFL (CPU 3) (Capable for double-wide GPU)
  • Slot 17: Empty
  • Slot 18: Gen5 x16 FHFL (CPU 2) (Capable for double-wide GPU)
  • Slot 19: Gen5 x16 FHHL (CPU 3)
  • Slot 20: Gen4 x16 FHHL (CPU 2) (Not present if select 7mm)

The 16-slot configuration (12x Gen5 slots + 4x Gen4 slots) is shown in the following figure. Blue slots are Gen4 and green slots are Gen5. The red shading indicates the slots where double-wide GPUs are supported. The processor that each slot is connected to is also shown in the figure.

Figure 10. Slot configuration with 12x Gen5 slots + 4x Gen4 slots

4x Gen4 + 2x OCP Gen5 slots

For applications that don't require many slots, the SR860 V3 also supports a configuration with 4x Gen4 slots plus 2x OCP slots. The configuration optionally supports 7mm hot-swap drive bays installed in riser 3.

• OCP slots:
  • Slot 1: Gen5 x16 OCP 3.0 slot (CPU 1, Note: OCP 3.0 is support PCIe Gen4)
  • Slot 2: Gen5 x16 OCP 3.0 slot (CPU 2, Note: OCP 3.0 is support PCIe Gen4)
• Riser 1:
  • Slot 3 ~ Slot 6: Empty
  • Slot 7: Gen4 x8 FHHL (CPU 1)
  • Slot 8: Gen4 x8 FHHL (CPU 1)
• Riser 2: Empty
  • Slot 9 ~ Slot 14: Empty
• Riser 3:
  • Slot 15 ~ Slot 18: Empty
  • Slot 19: Gen4 x8 FHHL (CPU 2)
  • Slot 20: Gen4 x8 FHHL (CPU 2)

The 4-slot configuration is shown in the following figure. Blue slots are Gen4 and green slots are Gen5. The processor that each slot is connected to is also shown in the figure.

Figure 11. Slot configuration with 4x Gen4 slots

Riser ordering information

The riser cards supported are listed in the following table. The table also lists the total slots and what type of slots each riser card includes. All of the x8 slots have a physical x16 connector.

Riser supported combinations

The SR860 V3 supports a mix of Gen5 and Gen4 PCIe slots using the combinations listed in the following table. The table also indicates which configurations support 7mm drives and which configurations support double-wide (DW) GPUs.

The SR860 V3 has two dedicated OCP 3.0 SFF slots with PCIe 5.0 x16 host interfaces. See Figure 3 for the location of the OCP slots.

The following table lists the supported OCP adapters. One port of each adapter can optionally be shared with the XCC management processor for Wake-on-LAN and NC-SI support.

The following table lists additional supported network adapters that can be installed in the regular PCIe slots.

For details about these adapters, see the relevant product guide:

• Ethernet adapters: https://lenovopress.com/servers/options/ethernet
• InfiniBand adapters: https://lenovopress.com/servers/options/infiniband

The following table lists the Fibre Channel HBAs supported by the server.

For more information, see the list of Lenovo Press Product Guides in the Host bus adapters category:
https://lenovopress.com/servers/options/hba

The following table lists SAS HBAs and RAID adapters supported by the server for use with external storage.

For a comparison of the functions of the supported storage adapters, see the ThinkSystem RAID Adapter and HBA Reference:
https://lenovopress.lenovo.com/lp1288#sr860-v3-support=SR860%2520V3&internal-or-external-ports=External

The RAID 940-8e adapter uses a flash power module (supercap) and the server supports up to four supercaps. The number of 940-8e RAID adapters supported is based on how many supercaps can be installed in the server. For example, if your configuration uses two RAID 940/9350 adapters for internal storage, then you can only install two RAID 940-8e adapters, since there is only space for four supercaps total. 

For details about these adapters, see the relevant product guide:

• SAS HBAs: https://lenovopress.com/servers/options/hba
• RAID adapters: https://lenovopress.com/servers/options/raid

The SR860 V3 currently does not support PCIe Flash Storage adapters.

The SR860 V3 supports the graphics processing units (GPUs) listed in the following table:

For details about these GPUs, see the ThinkSystem and ThinkAgile GPU Summary:
https://lenovopress.com/lp0768-thinksystem-thinkagile-gpu-summary

The following rules apply when using GPUs:

• Installed GPUs must be identical
• NVLink bridges are supported on certain GPUs as listed in the above table, 3 bridges per pair of GPUs. The use of the NVLink bridge requires that the two GPUs be installed next to each other (slots 4 & 6, or slots 16 & 18)
• For double-wide GPUs:
  • Base BT2K is required. See the Models section for details.
  • Only processors with TDP ≤ 270W are supported

• Some NVIDIA A Series GPUs are available as two feature codes, one with a CEC chip and one without a CEC chip (ones without the CEC chip have "w/o CEC" in the name). The CEC is a secondary Hardware Root of Trust (RoT) module that provides an additional layer of security, which can be used by customers who have high regulatory requirements or high security standards. NVIDIA uses a multi-layered security model and hence the protection offered by the primary Root of Trust embedded in the GPU is expected to be sufficient for most customers. The CEC defeatured products still offer Secure Boot, Secure Firmware Update, Firmware Rollback Protection, and In-Band Firmware Update Disable. Specifically, without the CEC chip, the GPU does not support Key Revocation or Firmware Attestation. CEC and non-CEC GPUs of the same type of GPU can be mixed in field upgrades.

Double-wide GPUs require an auxiliary power cable. For CTO orders, the necessary auxiliary power cables are automatically selected as part of configuration. For field upgrades, you will need to also order the power cable separately, as listed in the follwoing table. One part number is needed per GPU.

The server has 12 60mm hot-swap dual-rotor variable-speed fans at the front of the server and all 12 fans are standard in all models. The server offers N+1 redundancy, meaning that one fan can fail and the server still operates normally.

Each power supply also includes an integrated fan.

Figure 12. SR860 V3 cooling fan modules

When servicing the fan modules, you remove the modules from the top of the unit (hot-swap). Although the server supports N+1 redundancy (that is, supporting the failure of 1 fan while maintaining server operation), the server supports the removal of two fans for the time it takes to undertake a fan replacement: remove the module, replace the fan, reinsert the module.

The following table lists the CTO ordering information for the fan modules.

The server supports up to four redundant hot-swap power supplies. Redundancy can be configured as N+1 or N+N.

The 1100W Platinum power supply is auto-sensing and supports both 110V AC (100-127V 50/60 Hz) and 220V AC (200-240V 50/60 Hz) power. All other power supplies only supports 220V AC power. For China customers, all power supplies support 240V DC.

Configuration notes:

• Installed power supplies must be identical wattage. For CRPS power supplies, part numbers cannot be mixed.
• Power supply options do not include a line cord. For server configurations, the inclusion of a power cord is model dependent. Configure-to-order models can be configured without a power cord if desired.

Note: The SR860 V3 does not support Zero-output mode (also known as Standby mode) with power supplies.

The SR860 V3 contains an integrated service processor, XClarity Controller 2 (XCC), which provides advanced control, monitoring, and alerting functions. The XCC2 is based on the AST2600 baseboard management controller (BMC) using a dual-core ARM Cortex A7 32-bit RISC service processor running at 1.2 GHz.

Topics in this section:

• System I/O Board
• Local management
• System status with XClarity Mobile
• Remote management
• XCC2 Platinum
• Lenovo XClarity Provisioning Manager
• Lenovo XClarity Administrator
• Lenovo XClarity Integrators
• Lenovo XClarity Essentials
• Lenovo XClarity Energy Manager
• Lenovo Capacity Planner

System I/O Board

The SR860 V3 implements a separate System I/O Board that connects to the Processor Board. The location of the System I/O Board is shown in the Components and connectors section. The System I/O Board contains all the connectors visible at the rear of the server as shown in the following figure.

Figure 13. System I/O Board

The board also has the following components:

• XClarity Controller 2, implemented using the ASPEED AST2600 baseboard management controller (BMC).
• Root of Trust (RoT) module - a daughter card that implements Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) which enables the server to be NIST SP800-193 compliant. For more details about PFR, see the Security section.
• Connector to enable an additional redundant Ethernet connection to the XCC2 controller. The connector is used in conjunction with the ThinkSystem V3 Management NIC Adapter Kit (4XC7A85319). For details, see the Remote management section.
• Internal USB port - to allow the booting of an operating system from a USB key. The VMware ESXi preloads use this port for example. Preloads are described in the Operating system support section.
• MicroSD card port to enable the use of a MicroSD card for additional storage for use with the XCC2 controller. XCC2 can use the storage as a Remote Disc on Card (RDOC) device (up to 4GB of storage). It can also be used to store firmware updates (including N-1 firmware history) for ease of deployment.

  Tip: Without a MicroSD card installed, the XCC2 controller will have 100MB of available RDOC storage.

Ordering information for the supported USB drive and Micro SD card are listed in the following table.

Local management

Light path diagnostics

The server offers light path diagnostics. If an environmental condition exceeds a threshold or if a system component fails, XCC lights LEDs inside the server to help you diagnose the problem and find the failing part. The server has fault LEDs next to the following components:

• Each memory DIMM
• Each drive bay
• Each power supply

External Diagnostics Handset

The SR860 V3 has a port to connect an External Diagnostics Handset as described in the preceding section. The External Diagnostics Handset has the same functions as the Integrated Diagnostics Panel but has the advantages of not consuming space on the front of the server plus it can be shared among many servers in your data center. The handset has a magnet on the back of it to allow you to easily mount it on a convenient place on any rack cabinet.

Figure 15. External Diagnostics Handset

Ordering information for the External Diagnostics Handset with is listed in the following table.

Information tab

The front of the server also houses an information pull-out tab (also known as the network access tag). See Figure 2 for the location. A label on the tab shows the network information (MAC address and other data) to remotely access XClarity Controller.

The steps to connect the mobile device are as follows:

1. Enable USB Management on the server, by holding down the ID button for 3 seconds (or pressing the dedicated USB management button if one is present)
2. Connect the mobile device via a USB cable to the server's USB port with the management symbol
3. In iOS or Android settings, enable Personal Hotspot or USB Tethering
4. Launch the Lenovo XClarity Mobile app

Remote server management is provided through industry-standard interfaces:

• Intelligent Platform Management Interface (IPMI) Version 2.0
• Simple Network Management Protocol (SNMP) Version 3 (no SET commands; no SNMP v1)
• Common Information Model (CIM-XML)
• Representational State Transfer (REST) support
• Redfish support (DMTF compliant)
• Web browser - HTML 5-based browser interface (Java and ActiveX not required) using a responsive design (content optimized for device being used - laptop, tablet, phone) with NLS support

The SR860 V3 also supports the use of an OCP adapter that provides an additional redundant Ethernet connection to the XCC2 controller. Ordering information is listed in the following table.

The use of this adapter allows concurrent remote access using both the connection on the adapter and the onboard RJ45 remote management port provided by the server. The adapter and onboard port have separate IP addresses.

Configuration rules:

• In the SR860 V3, the ThinkSystem V3 Management NIC Adapter Kit is only supported in OCP slot 1

XCC2 Platinum includes the following Enterprise and Advanced functions:

• Remotely viewing video with graphics resolutions up to 1600x1200 at 75 Hz with up to 23 bits per pixel, regardless of the system state
• Remotely accessing the server using the keyboard and mouse from a remote client
• International keyboard mapping support
• Syslog alerting
• Redirecting serial console via SSH
• Component replacement log (Maintenance History log)
• Access restriction (IP address blocking)
• Lenovo SED security key management
• Displaying graphics for real-time and historical power usage data and temperature
• Boot video capture and crash video capture
• Virtual console collaboration - Ability for up to 6 remote users to be log into the remote session simultaneously
• Remote console Java client
• Mapping the ISO and image files located on the local client as virtual drives for use by the server
• Mounting the remote ISO and image files via HTTPS, SFTP, CIFS, and NFS
• Power capping
• System utilization data and graphic view
• Single sign on with Lenovo XClarity Administrator
• Update firmware from a repository
• License for XClarity Energy Manager

Topics in this section:

• Security features
• Platform Firmware Resiliency - Lenovo ThinkShield
• Intel Transparent Supply Chain
• Security standards

Security features

The SR860 V3 server offers the following electronic security features:

• Secure Boot function of the Intel Xeon processor
• Support for Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) - see the Platform Firmware Resiliency section
• Firmware signature processes compliant with FIPS and NIST requirements
• System Guard (part of XCC2 Platinum) - Proactive monitoring of hardware inventory for unexpected component changes
• Administrator and power-on password
• Integrated Trusted Platform Module (TPM) supporting TPM 2.0
• Self-encrypting drives (SEDs) with support for enterprise key managers - see the SED encryption key management section

The server is NIST SP 800-147B compliant.

The SR860 V3 server also offers the following physical security features:

• Chassis intrusion switch (standard on some models, otherwise available as a field upgrade)
• Lockable top cover to help prevent access to internal components

The following table lists the security options for the server.

For SED drives and IBM Security Key Lifecycle Manager support see the SED encryption key management with ISKLM section.

Platform Firmware Resiliency - Lenovo ThinkShield

Lenovo's ThinkShield Security is a transparent and comprehensive approach to security that extends to all dimensions of our data center products: from development, to supply chain, and through the entire product lifecycle.

The ThinkSystem SR860 V3 includes Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) which enables the system to be NIST SP800-193 compliant. This offering further enhances key platform subsystem protections against unauthorized firmware updates and corruption, to restore firmware to an integral state, and to closely monitor firmware for possible compromise from cyber-attacks.

PFR operates upon the following server components:

• UEFI image – the low-level server firmware that connects the operating system to the server hardware
• XCC image – the management “engine” software that controls and reports on the server status separate from the server operating system
• FPGA image – the code that runs the server’s lowest level hardware controller on the motherboard

The Lenovo Platform Root of Trust Hardware performs the following three main functions:

• Detection – Measures the firmware and updates for authenticity
• Recovery – Recovers a corrupted image to a known-safe image
• Protection – Monitors the system to ensure the known-good firmware is not maliciously written

These enhanced protection capabilities are implemented using a dedicated, discrete security processor whose implementation has been rigorously validated by leading third-party security firms. Security evaluation results and design details are available for customer review – providing unprecedented transparency and assurance.

The SR860 V3 includes support for Secure Boot, a UEFI firmware security feature developed by the UEFI Consortium that ensures only immutable and signed software are loaded during the boot time. The use of Secure Boot helps prevent malicious code from being loaded and helps prevent attacks, such as the installation of rootkits. Lenovo offers the capability to enable secure boot in the factory, to ensure end-to-end protection.

The following table lists the relevant feature code(s).

Security standards

The SR860 V3 supports the following security standards and capabilities:

• Industry Standard Security Capabilities
  • Intel CPU Enablement
    • AES-NI (Advanced Encryption Standard New Instructions)
    • CBnT (Converged Boot Guard and Trusted Execution Technology)
    • CET (Control flow Enforcement Technology)
    • Hardware-based side channel attack resilience enhancements
    • MKTME/TME (Multi-Key Total Memory Encryption)
    • SGX (Software Guard eXtensions)
    • SGX-TEM (Trusted Environment Mode)
    • TDX (Trust Domain Extensions)
    • TXT (Trusted eXecution Technology)
    • VT (Virtualization Technology)
    • XD (eXecute Disable)
  • Microsoft Windows Security Enablement
    • Credential Guard
    • Device Guard
    • Host Guardian Service
  • TCG (Trusted Computing Group) TPM (Trusted Platform Module) 2.0
  • UEFI (Unified Extensible Firmware Interface) Forum Secure Boot
• Hardware Root of Trust and Security
  • Independent security subsystem providing platform-wide NIST SP800-193 compliant Platform Firmware Resilience (PFR)
  • Management domain RoT supplemented by the Secure Boot features of XCC
• Platform Security
  • Boot and run-time firmware integrity monitoring with rollback to known-good firmware (e.g., “self-healing”)
  • Non-volatile storage bus security monitoring and filtering
  • Resilient firmware implementation, such as to detect and defeat unauthorized flash writes or SMM (System Management Mode) memory incursions
  • Patented IPMI KCS channel privileged access authorization (USPTO Patent# 11,256,810)
  • Host and management domain authorization, including integration with CyberArk for enterprise password management
  • KMIP (Key Management Interoperability Protocol) compliant, including support for IBM SKLM and Thales KeySecure
  • Reduced “out of box” attack surface
  • Configurable network services
  • FIPS 140-3 (in progress) validated cryptography for XCC
  • CNSA Suite 1.0 Quantum-resistant cryptography for XCC
  • Lenovo System Guard

  For more information on platform security, see the paper “How to Harden the Security of your ThinkSystem Server and Management Applications” available from https://lenovopress.com/lp1260-how-to-harden-the-security-of-your-thinksystem-server.

• Standards Compliance and/or Support
  • NIST SP800-131A rev 2 “Transitioning the Use of Cryptographic Algorithms and Key Lengths”
  • NIST SP800-147B “BIOS Protection Guidelines for Servers”
  • NIST SP800-193 “Platform Firmware Resiliency Guidelines”
  • ISO/IEC 11889 “Trusted Platform Module Library”
  • Common Criteria TCG Protection Profile for “PC Client Specific TPM 2.0”
  • European Union Commission Regulation 2019/424 (“ErP Lot 9”) “Ecodesign Requirements for Servers and Data Storage Products” Secure Data Deletion
  • Optional FIPS 140-2 validated Self-Encrypting Disks (SEDs) with external KMIP-based key management
• Product and Supply Chain Security
  • Suppliers validated through Lenovo’s Trusted Supplier Program
  • Developed in accordance with Lenovo’s Secure Development Lifecycle (LSDL)
  • Continuous firmware security validation through automated testing, including static code analysis, dynamic network and web vulnerability testing, software composition analysis, and subsystem-specific testing, such as UEFI security configuration validation
  • Ongoing security reviews by US-based security experts, with attestation letters available from our third-party security partners
  • Digitally signed firmware, stored and built on US-based infrastructure and signed on US-based Hardware Security Modules (HSMs)
  • Manufacturing transparency via Intel Transparent Supply Chain (for details, see https://lenovopress.com/lp1434-introduction-to-intel-transparent-supply-chain-on-lenovo-thinksystem-servers)
  • TAA (Trade Agreements Act) compliant manufacturing, by default in Mexico for North American markets with additional US and EU manufacturing options
  • US 2019 NDAA (National Defense Authorization Act) Section 889 compliant

The following table lists the rack installation options that are available for the server.

The following table summarizes the rail kit features and specifications.

* For 0U PDU support, the rack must be at least 1100 mm (43.31 in.) deep without the CMA, or at least 1200 mm (47.24 in.) deep if the CMA is used.
*** Measured when mounted on the rack, from the front surface of the front mounting flange to the rear most point of the rail.

For additional information, see the document Rail and supported rack specifications for ThinkSystem servers, available from:
https://www.lenovo.com/us/en/resources/data-center-solutions/brochures/thinksystem-rail-support-matrix/

The server supports the following operating systems:

• Microsoft Windows Server 2019
• Microsoft Windows Server 2022
• Microsoft Windows Server 2025
• Red Hat Enterprise Linux 8.6
• Red Hat Enterprise Linux 8.7
• Red Hat Enterprise Linux 8.8
• Red Hat Enterprise Linux 8.9
• Red Hat Enterprise Linux 8.10
• Red Hat Enterprise Linux 9.0
• Red Hat Enterprise Linux 9.1
• Red Hat Enterprise Linux 9.2
• Red Hat Enterprise Linux 9.3
• Red Hat Enterprise Linux 9.4
• SUSE Linux Enterprise Server 15 SP4
• SUSE Linux Enterprise Server 15 SP5
• SUSE Linux Enterprise Server 15 SP6
• SUSE Linux Enterprise Server 15 Xen SP4
• SUSE Linux Enterprise Server 15 Xen SP5
• Ubuntu 20.04 LTS 64-bit
• Ubuntu 22.04 LTS 64-bit
• Ubuntu 24.04 LTS 64-bit
• VMware ESXi 7.0 U3
• VMware ESXi 8.0
• VMware ESXi 8.0 U1
• VMware ESXi 8.0 U2
• VMware ESXi 8.0 U3

For a complete list of supported, certified and tested operating systems, plus additional details and links to relevant web sites, see the Operating System Interoperability Guide: https://lenovopress.lenovo.com/osig#servers=sr860-v3-7d94-7d93-7d95

For configure-to-order configurations, the SR860 V3 can be preloaded with VMware ESXi. Ordering information is listed in the following table.

Configuration rule:

• An ESXi preload cannot be selected if the configuration includes an NVIDIA GPU (ESXi preload cannot include the NVIDIA driver)

You can download supported VMware vSphere hypervisor images from the following web page and install it using the instructions provided:
https://vmware.lenovo.com/content/custom_iso/

The SR860 V3 has the following overall physical dimensions, excluding components that extend outside the standard chassis, such as EIA flanges, front security bezel (if any), and power supply handles:

• Width: 447 mm (17.6 inches)
• Height: 175 mm (6.9 inches)
• Depth: 906 mm (35.7 inches)

The following table lists the detailed dimensions. See the figure below for the definition of each dimension.

Figure 16. Server dimensions

The server has the following weight:

• Base configuration:
• Maximum weight: 59.4 kg (131 lb)

Electrical specifications for AC input power supplies:

• Input voltage:
  • 100 to 127 (nominal) Vac, 50 Hz or 60 Hz
  • 200 to 240 (nominal) Vac, 50 Hz or 60 Hz
  • 180 to 300 Vdc (China only)
• Inlet current: See the following table.

Electrical specifications for DC input power supply:

• Input voltage: -48 to -60 Vdc
• Inlet current (1100W power supply): 26 A

The SR860 V3 server complies with ASHRAE Class A2 specifications with most configurations, and depending on the hardware configuration, also complies with ASHRAE Class A3 and Class A4 specifications.

Depending on the hardware configuration, the SR860 V3 server also complies with ASHRAE Class H1 specification. System performance may be impacted when operating temperature is outside ASHRAE H1 specification.

Topics in this section:

• Temperature and humidity
• Ambient temperature requirements
• Acoustical noise emissions
• Shock and vibration
• Particulate contamination

Temperature and humidity

The server is supported in the following environment:

• Air temperature:
  • Operating
    • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
    • ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft).
    • ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900 m (2,953 ft).
    • ASHRAE Class H1: 5 °C to 25 °C (41 °F to 77 °F); Decrease the maximum ambient temperature by 1°C for every 500 m (1640 ft) increase in altitude above 900 m (2,953 ft).
  • Server off: 5°C to 45°C (41°F to 113°F)
  • Shipment/storage: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
  • Operating
    • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
    • ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
    • ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
    • ASHRAE Class H1: 8% to 80%; Maximum dew point: 17°C (63°F)
  • Shipment/storage: 8% to 90%

Ambient temperature requirements

Adjust ambient temperature when specific components are installed:

• The ambient temperature must be limited to 45°C or lower if the server has 48x drives and any of the following components:
  • CPUs with TDP ≤ 270W (except 6434H)
  • Memory module with 64 GB or lower capacity
• The ambient temperature must be limited to 35°C or lower if the server has 48x drives and any of the following components:
  • CPUs with TDP ≤ 350W with standard heat sink
  • Memory module with 256 GB or lower capacity
  • ConnectX-6 Dx 100GbE QSFP56 2-port with Active Optic Cable
  • ConnectX-6 HDR 200GbE QSFP56 2-port with Active Optic Cable
  • ConnectX-7 NDR200 QSFP 2-port without Active Optic Cable
  • ConnectX-7 NDR400 OSFP 1-port without Active Optic Cable
  • ConnectX-7 NDR200 QSFP 2-port with Active Optic Cable, and CPUs with TDP ≤ 270W is installed.
  • ConnectX-7 NDR400 OSFP 1-port with Active Optic Cable, and CPUs with TDP ≤ 270W is installed.
• The ambient temperature must be limited to 30°C or lower if the server has 48x drives and any of the following components:
  • CPUs with TDP ≤ 350W with performance heat sink
  • GPU adapters
  • ConnectX-7 NDR200 QSFP 2-port with Active Optic Cable
  • ConnectX-7 NDR400 OSFP 1-port with Active Optic Cable

Acoustical noise emissions

The server has the following acoustic noise emissions declaration:

• Sound power level (L_WAd)
  • Idling:
    • Typical: 7.1 Bel
    • Storage rich: 7.1 Bel
    • GPU: 8.0 Bel
  • Operating:
    • Typical: 8.0Bel
    • Storage rich: 8.0 Bel
    • GPU: 9.2 Bel
• Sound pressure level (L_pAm):
  • Idling:
    • Typical: 52.5dBA
    • Storage rich: 52.5 dBA
    • GPU: 63.6 dBA
  • Operating:
    • Typical: 63.6dBA
    • Storage: 63.6 dBA
    • GPU: 75.0 dBA

Notes:

• These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
• The declared acoustic sound levels are based on the specified configurations, which may change depending on configuration/conditions.
  • Typical configuration: four 250W CPUs, thirty-two 64GB RDIMMs, eight SAS HDDs, RAID 940-8i, Intel X710-T2L 10GBASE-T 2-port OCP, two 1100W PSUs.
  • GPU configuration: four 205W CPUs, Four H100 GPUs, thirty-two 64GB RDIMMs, twenty-four SAS HDDs, RAID 940-16i, Intel X710-T2L 10GBASE-T 2-port OCP, two 1800W PSUs.
  • Storage rich configuration: four 205W CPUs, thirty-two 64GB RDIMMs, twenty-four SAS HDDs, RAID 940-8i, Intel X710-T2L 10GBASE-T 2-port OCP, two 2600W PSUs.
• Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Shock and vibration

The server has the following vibration and shock limits:

• Vibration:
  • Operating: 0.21 G rms at 5 Hz to 500 Hz for 15 minutes across 3 axes
  • Non-operating: 1.04 G rms at 2 Hz to 200 Hz for 15 minutes across 6 surfaces
• Shock:
  • Operating: 15 G for 3 milliseconds in each direction (positive and negative X, Y, and Z axes)
  • Non-operating:
    • 23 kg - 31 kg: 35 G for 152 in./sec velocity change across 6 surfaces
    • 32 kg - 68 kg: 35 G for 136 in./sec velocity change across 6 surfaces

The following specifications indicate the limits of particulates that the system can tolerate:

• Reactive gases:
  • The copper reactivity level shall be less than 200 Angstroms per month (Å/month)
  • The silver reactivity level shall be less than 200 Å/month
• Airborne particulates:
  • The room air should be continuously filtered with MERV 8 filters.
  • Air entering a data center should be filtered with MERV 11 or preferably MERV 13 filters.
  • The deliquescent relative humidity of the particulate contamination should be more than 60% RH
  • Environment must be free of zinc whiskers

For additional information, see the Specifications section of the documentation for the server, available from the Lenovo Documents site, https://pubs.lenovo.com/

The SR860 V3 has a 1-year or 3-year warranty based on the machine type of the system:

• 7D94 - 1-year warranty
• 7D93 - 3-year warranty
• 7D95 - SAP HANA configurations with 3-year warranty

For more information, consult the brochure Lenovo Operational Support Services for Data Centers Services.

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• Deployment Services for Storage and ThinkAgile

  A comprehensive range of remote and onsite options tailored specifically for your business needs to ensure your storage and ThinkAgile hardware are fully operational from the start.

• Hardware Installation Services

  A full-range, comprehensive setup for your hardware, including unpacking, inspecting, and positioning components to ensure your equipment is operational and error-free for the most seamless and efficient installation experience, so you can quickly benefit from your investments.

• DM/DG File Migration Services

  Take the burden of file migration from your IT’s shoulders. Our experts will align your requirements and business objectives to the migration plans while coordinating with your team to plan and safely execute the data migration to your storage platforms.

• DM/DG/DE Health Check Services

  Our experts perform proactive checks of your Firmware and system health to ensure your machines are operating at peak and optimal efficiency to maximize up-time, avoid system failures, ensure the security of IT solutions and simplify maintenance.

• Factory Integrated Services

  A suite of value-added offerings provided during the manufacturing phase of a server or storage system that reduces time to value. These services aim at improving your hardware deployment experience and enhance the quality of a standard configuration before it arrives at your facility.

Lenovo Support Services

In addition to response time options for hardware parts, repairs, and labor, Lenovo offers a wide array of additional support services to ensure your business is positioned for success and longevity. Our goal is to reduce your capital outlays, mitigate your IT risks, and accelerate your time to productivity.

• Premier Support for Data Centers

  Your direct line to the solution that promises the best, most comprehensive level of support to help you fully unlock the potential of your data center.

• Premier Enhanced Storage Support (PESS)

  Gain all the benefits of Premier Support for Data Centers, adding dedicated storage specialists and resources to elevate your storage support experience to the next level.

• Committed Service Repair (CSR)

  Our commitment to ensuring the fastest, most seamless resolution times for mission-critical systems that require immediate attention to ensure minimal downtime and risk for your business. This service is only available for machines under the Premier 4-Hour Response SLA.

• Multivendor Support Services (MVS)

  Your single point of accountability for resolution support across vast range of leading Server, Storage, and Networking OEMs, allowing you to manage all your supported infrastructure devices seamlessly from a single source.

• Keep Your Drive (KYD)

  Protect sensitive data and maintain compliance with corporate retention and disposal policies to ensure your data is always under your control, regardless of the number of drives that are installed in your Lenovo server.

• Technical Account Manager (TAM)

  Your single point of contact to expedite service requests, provide status updates, and furnish reports to track incidents over time, ensuring smooth operations and optimized performance as your business grows.

• Enterprise Software Support (ESS)

  Gain comprehensive, single-source, and global support for a wide range of server operating systems and Microsoft server applications.

For more information, consult the brochure Lenovo Operational Support Services for Data Centers.

Lenovo Managed Services

Achieve peak efficiency, high security, and minimal disruption with Lenovo's always-on Managed Services. Our real-time monitoring, 24x7 incident response, and problem resolution ensure your infrastructure operates seamlessly. With quarterly health checks for ongoing optimization and innovation, Lenovo's remote active monitoring boosts end-user experience and productivity by keeping your data center's hardware performing at its best.

Lenovo Managed Services provides continuous 24x7 remote monitoring (plus 24x7 call center availability) and proactive management of your data center using state-of-the-art tools, systems, and practices by a team of highly skilled and experienced Lenovo services professionals.

Quarterly reviews check error logs, verify firmware & OS device driver levels, and software as needed. We’ll also maintain records of latest patches, critical updates, and firmware levels, to ensure you systems are providing business value through optimized performance.

Lenovo Sustainability Services

• Asset Recovery Services

  Lenovo Asset Recovery Services (ARS) provides a secure, seamless solution for managing end-of-life IT assets, ensuring data is safely sanitized while contributing to a more circular IT lifecycle. By maximizing the reuse or responsible recycling of devices, ARS helps businesses meet sustainability goals while recovering potential value from their retired equipment. For more information, see the Asset Recovery Services offering page.

• CO2 Offset Services

  Lenovo’s CO2 Offset Services offer a simple and transparent way for businesses to take tangible action on their IT footprint. By integrating CO2 offsets directly into device purchases, customers can easily support verified climate projects and track their contributions, making meaningful progress toward their sustainability goals without added complexity.

• Lenovo Certified Refurbished

  Lenovo Certified Refurbished offers a cost-effective way to support IT circularity without compromising on quality and performance. Each device undergoes rigorous testing and certification, ensuring reliable performance and extending its lifecycle. With Lenovo’s trusted certification, you gain peace of mind while making a more sustainable IT choice.

Lenovo TruScale XaaS is your set of flexible IT services that makes everything easier. Streamline IT procurement, simplify infrastructure and device management, and pay only for what you use – so your business is free to grow and go anywhere.

Lenovo TruScale is  the unified solution that gives you simplified access to:

• The industry’s broadest portfolio – from pocket to cloud – all delivered as a service
• A single-contract framework for full visibility and accountability
• The global scale to rapidly and securely build teams from anywhere
• Flexible fixed and metered pay-as-you-go models with minimal upfront cost
• The growth-driving combination of hardware, software, infrastructure, and solutions – all from one single provider with one point of accountability.

For information about Lenovo TruScale offerings that are available in your region, contact your local Lenovo sales representative or business partner.

The SR860 V3 conforms to the following standards:

• ANSI/UL 62368-1
• IEC 62368-1 (CB Certificate and CB Test Report)
• CSA C22.2 No. 62368-1
• Argentina IEC 60950-1
• Mexico NOM-019
• India BIS 13252 (Part 1)
• Germany GS
• TUV-GS (EN62368-1, and EK1-ITB2000)
• Brazil INMETRO
• South Africa NRCS LOA
• Ukraine UkrCEPRO
• Morocco CMIM Certification (CM)
• Russia, Belorussia and Kazakhstan, TP EAC 037/2016 (for RoHS)
• Russia, Belorussia and Kazakhstan, EAC: TP TC 004/2011 (for Safety); TP TC 020/2011 (for EMC)
• CE, UKCA Mark (EN55032 Class A, EN62368-1, EN55024, EN55035, EN61000-3-2, EN61000-3-3, (EU) 2019/424, and EN IEC 63000 (RoHS))
• FCC - Verified to comply with Part 15 of the FCC Rules, Class A
• Canada ICES-003, issue 7, Class A
• CISPR 32, Class A, CISPR 35
• Korea KN32, Class A, KN35
• Japan VCCI, Class A
• Taiwan BSMI CNS15936, Class A; CNS15598-1; Section 5 of CNS15663
• Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
• UL Green Guard, UL2819
• Energy Star 4.0
• EPEAT (NSF/ ANSI 426) Bronze
• Japanese Energy-Saving Act
• EU2019/424 Energy Related Product (ErP Lot9)
• China CELP certificate, HJ 2507-2011

The server supports attachment to external drive enclosures using a RAID controller with external ports or a SAS host bus adapter. Adapters supported by the server are listed in the SAS adapters for external storage section.

Note: Information provided in this section is for ordering reference purposes only. For the operating system and adapter support details, refer to the interoperability matrix for a particular storage enclosure that can be found on the Lenovo Data Center Support web site:
http://datacentersupport.lenovo.com

Lenovo offers the ThinkSystem DE Series and ThinkSystem DM Series external storage systems for high-performance storage. See the DE Series and DM Series product guides for specific controller models, expansion enclosures and configuration options:

• ThinkSystem DE Series Storage
  https://lenovopress.com/storage/thinksystem/de-series#rt=product-guide
• ThinkSystem DM Series Storage
  https://lenovopress.com/storage/thinksystem/dm-series#rt=product-guide
• ThinkSystem DG Series Storage
  https://lenovopress.com/storage/thinksystem/dg-series#rt=product-guide

The following table lists the external backup options that are offered by Lenovo.

For more information, see the list of Product Guides in the Backup units category:
https://lenovopress.com/servers/options/backup

Lenovo offers the ThinkSystem DB Series of Fibre Channel SAN switches for high-performance storage expansion. See the DB Series product guides for models and configuration options:

• ThinkSystem DB Series SAN Switches:
  https://lenovopress.com/storage/switches/rack#rt=product-guide

The following table lists the uninterruptible power supply (UPS) units that are offered by Lenovo.

For more information, see the list of Product Guides in the UPS category:
https://lenovopress.com/servers/options/ups

The following table lists the power distribution units (PDUs) that are offered by Lenovo.